Integrate meta-seco-imx/linux-seco-imx/add_mv_device_config

Commit: clea-os/layers/seco/meta-seco-imx@962bdfa6

Integrate linux-seco-imx/add_mv_device_config

--

Commit: clea-os/bsp/nxp/linux-seco-imx@5dfd5800

[D18][MV][DTBO] Change carrier boards eeprom address to 0x53

There is a collision on 0x50 between the eeprom on the carrier and the eeprom on the module. As the SMARC standard defines the eeprom address on the SMARC module to be 0x50 this is kept and the carrier board is rewired to change the eeprom's address. The SMARC standard suggests 0x57 for the carrier. This is not possible with the REVA of the carrier, but will be used on the REVB. On the REVA the only possible, not colliding address available was 0x53, so we use this for the REVA.

--

Commit: clea-os/bsp/nxp/linux-seco-imx@cb933af1

[D18][DTBO] Disable the SMARC module's eeprom on MV (because of seco-eeprom-manager)

The internal EEPROM is currently required for the storage of the panel and touch configuration. Since the EEPROM manager tool communicates directly with the EEPROM, we have to remove it from the DT.

--

Commit: clea-os/bsp/nxp/linux-seco-imx@84c6e901

[D18][MV][DTBO] Add device config for the MV overlay (dummy node)

The node is parsed in U-Boot to resolve the panel and touch IDs from the EEPROM device config data-structure. From linux point of view, it is a dummy node, as there is no related driver/device available. Addes this as comment for the seco,device-config node also in the devicetree.

--

Commit: clea-os/bsp/nxp/linux-seco-imx@7202b7d1

[NONFUNCTIONAL] Remove executable bit from devicetree files